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PACK EXPO International

Date: 10/18/2026

Location: Chicago - McCormick Place

McCormick Place Convention Center
2301 S Dr Martin Luther King Jr Dr
Chicago
Illinois
60616
United States

Map and Directions

The OPC Foundation is a proud Partner of PACK EXPO International (Oct 18-21, 2026 in Chicago) – the main event for processing and packaging in 2026. Participating in the Partner Program allows us to be on-site promoting and supporting our members.

Join the OPC Foundation booth N-5001 (in the North Building) and …

  • … see the live demo of horizontal Controller-to-Controller communications based on OPC UA FX series – the one and only harmonized OPC UA solution for both Process- and Factory-Automation, including deterministic, motion, instrumentation and OPC UA Safety.
  • … learn about the live demo of “OPC UA over MQTT” – the IEC standard for multi-vendor cloud solutions: 
    • Field to Cloud
    • Cloud to Cloud
    • Cloud to Field
  • … meet Mike Clark, the Director North America, OPC Foundation and learn more about the OPC UA technology