IO-Link

Overview

IO-Link Consortium signed a Memorandum of Understanding (“MoU”) to establish a cooperative forum between the IO-Link Consortium and the OPC Foundation (“OPC”) at Hannover trade show 26 April 2016.  The purpose of the MoU was to define the desired level of cooperation between the parties to the MoU to contribute to the goals of interface definitions as outlined below.

Technical Overview

The goal for OPC is for it to be the foundation for interoperability for moving information vertically from sensors and actuators through the enterprise of multi-vendor systems as well as providing interoperability between devices on different industrial networks from different vendors.

 Companies behind

  • Siemens
  • Pepperl & Fuchs
  • IFM
  • Balluff
  • Sick

More Information:

  • See here: Video “OPC UA and IO-Link” by Dr. Elmar Bücherl
  • See here: Video “OPC UA and IO-Link” by Reinhard Schlagenhaufer

About IO-Link

The IO-Link Consortium is an organization in which key user companies from various industries and leading automation suppliers join forces to support, promote and advance the IO-Link technology. With over 120 members and strong support in Europe, Asia and the Americas IO-Link has become the leading sensor and actuator interface in the world. Founded in 2006, it is also the fastest growing sensor and actuator interface. The IO-Link standard stands for easy wiring, high-compatibility, high functionality and easy handling. It was introduced in 2006, and is an international IEC. The IO-Link Protocol implements a master/device architecture. IO-Link is fieldbus independent and can be integrated into all fieldbus systems worldwide.

 

Contact information

  • IO-Link Steering Committee Speaker: Reinhard Schlagenhaufer, reinhard.schlagenhaufer_at_siemens.com
  • IO-Link Head of Marketing, Dr. Elmar Bücherl, Elmar.Buechler_at_balluff.de